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Description: High performance chip-on-board (COB) encapsulants, conductive adhesives, display sealants, electrically conductive films, printed circuit board (PCB) protection materials, underfills and a wide range of thermal management products.

Keywords: chip-on-board (COB) encapsulants conductive adhesives display sealants electrically conductive films printed circuit board (PCB) protection materials underfills thermal management materials thermal interface

Related Clusters: Process materials, Assurancesa, Client sites, Esg

Visit Page: http://www.emersoncuming.com
Last Checked: November 10, 2009 at 03:37:02 AM
HTTP Status: OK
Family Friendly? Yes

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